在线式选择性波峰焊型号 SUNFLOW3
机体参数
General technical data
PCB 板尺寸/Max PCB size (mm) 510(L)x450(W)
最小PCB 板尺寸/Min PCB size (mm) 120(L)x50(W)
PCB 顶部间隙/PCB top sideclearance (mm) 120
PCB 底部间隙/PCB bottom sideclearance (mm) 30
PCB 工艺边/PCB technics side(mm) ≥3
传送带距离地面高度/Conveyor height from floor (mm) 850±25
PCB 传送速度/PCB conveyorspeed (m/min) 0-12
PCB 重量/Max PCB weight(kg) ≤5
PCB 厚度(包含治具)/PCBthickness (including fixture) (mm) 1-6
传送带可调范围/Conveyor width adjustment (mm) 50-450
传送带调宽方式/Conveyor width adjustment mode 电动/Electromotion
传送带可调宽精度/Conveyor width adjusted accuracy (mm) ±0.1
PCB 传送方向/PCB Conveyordirection 左向右/Left to right
压缩空气所需压力/Compressed air required pressure (Mpa) 0.5-0.8
电源电压/Main voltage(VAC) 380
电压容差/Voltage tolerance range (%) 6-10
频率/Frequency (HZ) 50/60
功耗/Max power consumption (kw) <25
电流/Max amperage (A) <34
环境温度/Ambient temperature (℃) 10-35
机器噪音/Permanent sound level (dB) <65
通讯接口/Communication interface SMEMA
设备外形尺寸/Overall dimensions(mm) 3010(L)*1620(W)*1700(H)
设备重量/Equipment weight(kg) 2000
焊接系统
Soldering module
焊接喷嘴/Solder nozzle 高精度单喷嘴/High precision single nozzle
最小喷嘴外径/Smallest nozzle outer diameter (mm) 5.5
喷嘴内径/Nozzle inner diameter (mm) 2.5-10
波峰高度/Max solder wave height (mm) 5
锡炉容量/Solder volume (kg) 5
焊接温度/Max solder temperature (℃) 350±2
锡炉加热功率/Soldering heating power (kw) 1.3
氮气供应/Nitrogen supply 由客户提供/Offered bycustomer
氮气所需压力/Nitrogen required pressure (Mpa) 0.3
氮气消耗量/Nitrogen consumption (m3/h) 1.2
所需氮气纯度/Required particle cleanliness (%) ﹥99.99
预热系统
Preheating module
预热温度范围/Preheat temperature range (℃) 0-200
预热控温精度/Preheat control accuracy (℃) ±2
加热功率/Preheating medium (kw) 21
PCB 温度均匀性/PCB temperatureuniformity (℃) 5
加热方式/Preheating medium 热风+红外/Hotair+Infrared
顶部预热/Top side preheating 热风/Hot air
喷雾系统
Flux module
喷雾高度/Spray height(mm) 60
喷雾速度/Control speed(mm/s) ≤400
喷嘴自动清洗功能/Spray head automatically cleaning 程序控制/Programcontrol
助焊剂流量/Flux consumption(ml/min) 2-60
助焊剂箱体容量/Flux content(L) 2